Printed Electronics for Smart Packaging

Name: Printed Electronics for Smart Packaging
Price: 139 EUR
Availability: InStock
Author: Wu, Wei
ISBN: 978-3-527-35116-9

Wu, Wei (24.12.2025)

Wiley-VCH

Printed Electronics for Smart Packaging · Wu, Wei

✍ Wu, Wei 🎴 1135116 000

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Produktdetails ▾

Produktnummer: 9783527351169
Verlag: Wiley-VCH
Autor: Wu, Wei
ISBN: 978-3-527-35116-9
Produktform: Hardcover
Veröffentlichung: 24.12.2025

Produktinformationen "Printed Electronics for Smart Packaging"

Verlag: Wiley-VCH
Autor: Wu, Wei
ISBN: 978-3-527-35116-9
Bestellnummer: 1135116 000
Veröffentlichung: 24.12.2025
Umfang: 320 Seiten
Maße: 170 x 15 x 244 (B/T/H)
Gewicht: 666
Sprache: englisch
Auflage: 1. Auflage
Copyright: © 2026
MwSt: 7 %
Lesemotiv: Verstehen
Produktart: Buch gebunden
Produktform: Hardcover

Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging

Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.

Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as:

* Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
* Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
* Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
* Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field

A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.

Biografie – Wu, Wei

Wu, Wei

Wei Wu received his Ph.D. degree in materials physics and chemistry from Wuhan University in 2011. He then joined the group of Prof. Daiwen Pang at Wuhan University (2011) and Prof. V. A. L. Roy at City University of Hong Kong (2014) as a postdoctoral fellow. Currently, he is the full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014. He has published over 100 papers, which have received over 7500 citations. His research interests include the synthesis and application of printable functional materials, printed electronics, wearable electronics and intelligent packaging.

Jing Liang, PhD, Laboratory of Printable Functional Materials and Printed Electronics, School of Printing and Packaging, Wuhan University in China.

Themen:

Electrical & Electronics Engineering Electronic Materials Electronic Packaging Elektronikbauteile Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Materials Science Materialwissenschaften Physics Physik Semiconductor Physics

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